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Connectors, Interconnects
36-3575-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 36POS TIN
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Connectors, Interconnects
36-3575-10
ActiveAries Electronics
CONN IC DIP SOCKET ZIF 36POS TIN
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics for this part
| Specification | 36-3575-10 |
|---|---|
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Mating | 5.08 µm |
| Contact Finish Thickness - Mating | 200 µin |
| Contact Finish Thickness - Post | 200 µin |
| Contact Finish Thickness - Post | 5.08 µm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post | Beryllium Copper |
| Current Rating (Amps) | 1 A |
| Features | Closed Frame |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 36 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 0.11 in |
| Termination Post Length | 2.78 mm |
| Type | 7.62 mm |
| Type | 0.3 in |
| Type | DIP, ZIF (ZIP) |
36-3575 Series
| Part | Contact Finish - Post | Number of Positions or Pins (Grid) | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination | Features | Material Flammability Rating | Current Rating (Amps) | Housing Material | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Type | Type | Type | Mounting Type | Pitch - Post | Pitch - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Tin | 36 | Beryllium Copper | 200 µin | 5.08 µm | Solder | Closed Frame | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Through Hole | 2.54 mm | 0.1 in | Beryllium Copper | 5.08 µm | 200 µin |
Aries Electronics | Tin | 36 | Beryllium Copper | 200 µin | 5.08 µm | Solder | Closed Frame | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Through Hole | 2.54 mm | 0.1 in | Beryllium Copper | 5.08 µm | 200 µin |
Aries Electronics | Tin | 36 | Beryllium Copper | 200 µin | 5.08 µm | Solder | Closed Frame | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Through Hole | 2.54 mm | 0.1 in | Beryllium Copper | 5.08 µm | 200 µin |
Aries Electronics | Tin | 36 | Beryllium Copper | 200 µin | 5.08 µm | Solder | Closed Frame | UL94 V-0 | 1 A | Polyphenylene Sulfide (PPS) Glass Filled | 0.1 in | 2.54 mm | 0.11 in | 2.78 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Through Hole | 2.54 mm | 0.1 in | Beryllium Copper | 5.08 µm | 200 µin |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 25 | $ 16.11 | |
Description
General part information
36-3575 Series
36 (2 x 18) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole
Documents
Technical documentation and resources