Soldering, Desoldering, Rework Products

SMD2SWLT.040 20G

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SN42/BI57.6/AG0.4 2.2% FLUX CORE

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Soldering, Desoldering, Rework Products

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SN42/BI57.6/AG0.4 2.2% FLUX CORE

Technical Specifications

Parameters and characteristics for this part

Part	Form	Form	Form	Form	Diameter [diameter]	Diameter [diameter]	Type	Melting Point	Melting Point	Composition	Composition	Wire Gauge	Flux Type
Chip Quik Inc. SMD2SWLT.047 8OZ	0.5 lb	8 oz	227 g	Spool	0.047 in	1.19 mm	Wire Solder	280 °F	138 °C	0.4 % 42 % 57.6 %
Chip Quik Inc. SMD2SWLF.031 8OZ	0.5 lb	8 oz	227 g	Spool			Wire Solder	441 °F	227 °C		Sn99.3Cu0.7 (99.3/0.7)	20 AWG 22 SWG	No-Clean Water Soluble
Chip Quik Inc. SMD2SWLF.031 2OZ		2 oz	56.7 g	Spool			Wire Solder	441 °F	227 °C		Sn99.3Cu0.7 (99.3/0.7)		No-Clean Water Soluble
Chip Quik Inc. SMD2SWLT.047 4OZ		4 oz	113.4 g	Spool	0.047 in	1.19 mm	Wire Solder	280 °F	138 °C	0.4 % 42 % 57.6 %
Chip Quik Inc. SMD2SWLT.040 100G		3.53 oz	100 g	Spool	0.04 in	1.02 mm	Wire Solder	280 °F	138 °C	0.4 % 42 % 57.6 %			No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 20G		0.7 oz	20 g	Spool	0.04 in	1.02 mm	Wire Solder	280 °F	138 °C	0.4 % 42 % 57.6 %			No-Clean Rosin Activated (RA)
Chip Quik Inc. SMD2SWLT.040 10G		0.35 oz	10 g	Spool	0.04 in	1.02 mm	Wire Solder	280 °F	138 °C	0.4 % 42 % 57.6 %			No-Clean Rosin Activated (RA)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Lead Free No-Clean, Rosin Activated (RA) Wire Solder Bi57.6Sn42Ag0.4 (57.6/42/0.4) Spool, 0.7 oz (20g)

Technical documentation and resources