SMD2S Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER SN42/BI57.6/AG0.4 .047" SOLDER WIRE 8OZ SPOOL
| Part | Form | Form | Form | Form | Diameter [diameter] | Diameter [diameter] | Type | Melting Point | Melting Point | Composition | Composition | Wire Gauge | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 0.5 lb | 8 oz | 227 g | Spool | 0.047 in | 1.19 mm | Wire Solder | 280 °F | 138 °C | 0.4 % 42 % 57.6 % | |||
 Chip Quik Inc. | 0.5 lb | 8 oz | 227 g | Spool | Wire Solder | 441 °F | 227 °C | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG 22 SWG | No-Clean Water Soluble | |||
 Chip Quik Inc. | 2 oz | 56.7 g | Spool | Wire Solder | 441 °F | 227 °C | Sn99.3Cu0.7 (99.3/0.7) | No-Clean Water Soluble | |||||
 Chip Quik Inc. | 4 oz | 113.4 g | Spool | 0.047 in | 1.19 mm | Wire Solder | 280 °F | 138 °C | 0.4 % 42 % 57.6 % | ||||
 Chip Quik Inc. | 3.53 oz | 100 g | Spool | 0.04 in | 1.02 mm | Wire Solder | 280 °F | 138 °C | 0.4 % 42 % 57.6 % | No-Clean Rosin Activated (RA) | |||
 Chip Quik Inc. | 0.7 oz | 20 g | Spool | 0.04 in | 1.02 mm | Wire Solder | 280 °F | 138 °C | 0.4 % 42 % 57.6 % | No-Clean Rosin Activated (RA) | |||
 Chip Quik Inc. | 0.35 oz | 10 g | Spool | 0.04 in | 1.02 mm | Wire Solder | 280 °F | 138 °C | 0.4 % 42 % 57.6 % | No-Clean Rosin Activated (RA) |