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SCS310AGC16
Discrete Semiconductor Products

SCS310AGC16

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 10 A, 24 NC, TO-220ACGE

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SCS310AGC16
Discrete Semiconductor Products

SCS310AGC16

Active
Rohm Semiconductor

SILICON CARBIDE SCHOTTKY DIODE, SINGLE DUAL CATHODE, 650 V, 10 A, 24 NC, TO-220ACGE

Technical Specifications

Parameters and characteristics for this part

SpecificationSCS310AGC16
Capacitance @ Vr, F500 pF
Current - Average Rectified (Io)10 A
Current - Reverse Leakage @ Vr50 µA
Mounting TypeThrough Hole
Operating Temperature - Junction175 °C
Package / CaseTO-220-2
Reverse Recovery Time (trr)0 ns
Speed500 mA
Supplier Device PackageTO-220ACFP
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]650 V
Voltage - Forward (Vf) (Max) @ If [Max]1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 40$ 5.78
NewarkEach 1$ 6.01
10$ 5.18
25$ 4.35
50$ 3.52
100$ 3.16
250$ 3.01
500$ 2.86

Description

General part information

SCS310AG Series

Switching loss reduced, enabling high-speed switching.

Documents

Technical documentation and resources

SCS310AGC16 | Datasheet

Datasheet

Application Note for SiC Power Devices and Modules

Schematic Design & Verification

About Export Administration Regulations (EAR)

Export Information

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

How to Suppress the Parallel Drive Oscillation in SiC Modules

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Part Explanation

Application Note

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Compliance of the ELV directive

Environmental Data

Anti-Whisker formation

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Condition of Soldering / Land Pattern Reference

Package Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

What Is Thermal Design

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Flammability of Materials

Environmental Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

What is a Thermal Model? (SiC Power Device)

Thermal Design

Explanation for Marking

Package Information

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Oscillation countermeasures for MOSFETs in parallel

Schematic Design & Verification

Package Dimension - SiC TO-220ACGE

Package Information

PCB Layout Thermal Design Guide

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Diode Types and Applications

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use Thermal Models

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

4 Steps for Successful Thermal Designing of Power Devices

White Paper