Connectors, Interconnects

6-1437532-1

Obsolete

CONN IC DIP SOCKET 32POS GOLD

Search across all available documentation for this part.

Connectors, Interconnects

Obsolete

CONN IC DIP SOCKET 32POS GOLD

Technical Specifications

Parameters and characteristics for this part

Specification	6-1437532-1

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Post	0.63 µm
Contact Finish Thickness - Post	25 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	10 mOhm
Features	Closed Frame
Housing Material	Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	32
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.1 in
Pitch - Post	2.54 mm
Termination	Solder
Termination Post Length	0.125 in
Termination Post Length	3.18 mm
Type	DIP
Type [custom]	15.24 mm
Type [custom]	0.6 in

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Contact Resistance	Termination	Housing Material	Contact Finish - Mating	Mounting Type	Contact Material - Mating	Number of Positions or Pins (Grid)	Operating Temperature [Min]	Operating Temperature [Max]	Type [custom]	Type [custom]	Type	Contact Finish - Post	Contact Material - Post [custom]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post
TE Connectivity AMP Connectors 5-1437532-0	0.125 in	3.18 mm	UL94 V-0	10 mOhm	Solder	Polyester	Gold	Through Hole	Copper Alloy	28	-55 C	125 °C	15.24 mm	0.6 in	DIP	Gold	Copper Alloy	0.1 in	2.54 mm	0.1 "	2.54 mm	Closed Frame
TE Connectivity AMP Connectors 7-1437532-1	0.125 in	3.18 mm	UL94 V-0		Solder	Polyester	Gold	Through Hole	Copper Alloy	36	-55 C	125 °C	15.24 mm	0.6 in	DIP	Gold	Copper Alloy	0.1 in	2.54 mm	0.1 "	2.54 mm	Closed Frame	0.63 µm	25 µin
TE Connectivity AMP Connectors 6-1437532-1	0.125 in	3.18 mm	UL94 V-0	10 mOhm	Solder	Polyester	Gold	Through Hole	Beryllium Copper	32	-55 C	125 °C	15.24 mm	0.6 in	DIP	Gold		0.1 in	2.54 mm	0.1 "	2.54 mm	Closed Frame	0.63 µm	25 µin	Beryllium Copper

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 3.43

General part information

32 (2 x 16) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Technical documentation and resources

No documents available