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Discrete Semiconductor Products

UT6ME5TCR

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Rohm Semiconductor

100V 2.0A/1.0A, DUAL NCH+PCH, DFN2020-8D, POWER MOSFET

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Product dimension image
Discrete Semiconductor Products

UT6ME5TCR

Active
Rohm Semiconductor

100V 2.0A/1.0A, DUAL NCH+PCH, DFN2020-8D, POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationUT6ME5TCR
ConfigurationN and P-Channel
Current - Continuous Drain (Id) @ 25°C1 A, 2 A
Drain to Source Voltage (Vdss)100 V
Gate Charge (Qg) (Max) @ Vgs2.8 nC, 6.7 nC
Input Capacitance (Ciss) (Max) @ Vds90 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case6-PowerUDFN
Power - Max [Max]2 W
Rds On (Max) @ Id, Vgs840 mOhm, 207 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 14554$ 0.47

Description

General part information

UT6ME5 Series

UT6ME5 is a low on-resistance MOSFET ideal for switching applications. This product includes two 100V MOSFETs in a small surface mount package (DFN2020-8D).

Documents

Technical documentation and resources

What Is Thermal Design

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

Explanation for Marking

Package Information

UT6ME5 ESD Data

Characteristics Data

Moisture Sensitivity Level - Transistors

Package Information

Compliance of the RoHS directive

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

About Flammability of Materials

Environmental Data

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

UT6ME5 Data Sheet

Data Sheet

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Taping Information

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Part Explanation

Application Note

How to Use LTspice® Models

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Package Dimensions

Package Information

Anti-Whisker formation - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

Certificate of not containing SVHC under REACH Regulation

Environmental Data

About Export Regulations

Export Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design