Soldering, Desoldering, Rework Products

SMDSW.020 8OZ

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SOLDER WIRE 63/37 TIN/LEAD NO-CL

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Soldering, Desoldering, Rework Products

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SOLDER WIRE 63/37 TIN/LEAD NO-CL

Technical Specifications

Parameters and characteristics for this part

Part	Form	Form	Form	Melting Point	Melting Point	Type	Diameter [diameter]	Diameter [diameter]	Composition	Composition	Form	Process	Wire Gauge	Flux Type
Chip Quik Inc. SMDSWLT.047 4OZ	113.4 g	4 oz	Spool	280 °F	138 °C	Wire Solder	0.047 in	1.19 mm	57/42/1	Bi57Sn42Ag1
Chip Quik Inc. SMDSWLT.047 1OZ	1 oz		Spool	280 °F	138 °C	Wire Solder	0.047 in	1.19 mm	57/42/1	Bi57Sn42Ag1	28.35 g
Chip Quik Inc. SMDSWLT.047 2OZ	56.7 g	2 oz	Spool	280 °F	138 °C	Wire Solder	0.047 in	1.19 mm	57/42/1	Bi57Sn42Ag1
Chip Quik Inc. SMDSW.015 100G	100 g	3.53 oz	Spool	361 °F		Wire Solder	0.015 in	0.38 mm				Leaded	27 AWG 28 SWG	No-Clean Water Soluble
Chip Quik Inc. SMDSWLT.047 8OZ	227 g	8 oz	Spool	280 °F	138 °C	Wire Solder	0.047 in	1.19 mm	57/42/1	Bi57Sn42Ag1	0.5 lb
Chip Quik Inc. SMDSW.020 8OZ	227 g	8 oz	Spool	361 °F		Wire Solder	0.02 in	0.51 mm			0.5 lb	Leaded	24 AWG 25 mmý	No-Clean Water Soluble

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb

Technical documentation and resources