SMDSW Series
Manufacturer: Chip Quik Inc.
Beta
⌘K
SOLDER WIRE SN42/BI57/AG1 .047"
| Part | Form | Form | Form | Melting Point | Melting Point | Type | Diameter [diameter] | Diameter [diameter] | Composition | Composition | Form | Process | Wire Gauge | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Chip Quik Inc. | 113.4 g | 4 oz | Spool | 280 °F | 138 °C | Wire Solder | 0.047 in | 1.19 mm | 57/42/1 | Bi57Sn42Ag1 | ||||
 Chip Quik Inc. | 1 oz | Spool | 280 °F | 138 °C | Wire Solder | 0.047 in | 1.19 mm | 57/42/1 | Bi57Sn42Ag1 | 28.35 g | ||||
 Chip Quik Inc. | 56.7 g | 2 oz | Spool | 280 °F | 138 °C | Wire Solder | 0.047 in | 1.19 mm | 57/42/1 | Bi57Sn42Ag1 | ||||
 Chip Quik Inc. | 100 g | 3.53 oz | Spool | 361 °F | Wire Solder | 0.015 in | 0.38 mm | Leaded | 27 AWG 28 SWG | No-Clean Water Soluble | ||||
 Chip Quik Inc. | 227 g | 8 oz | Spool | 280 °F | 138 °C | Wire Solder | 0.047 in | 1.19 mm | 57/42/1 | Bi57Sn42Ag1 | 0.5 lb | |||
 Chip Quik Inc. | 227 g | 8 oz | Spool | 361 °F | Wire Solder | 0.02 in | 0.51 mm | 0.5 lb | Leaded | 24 AWG 25 mmý | No-Clean Water Soluble |