Connectors, Interconnects

44-647-10

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SOCKET ADAPTER SOIC TO 44DIP 0.6

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Connectors, Interconnects

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SOCKET ADAPTER SOIC TO 44DIP 0.6

Technical Specifications

Parameters and characteristics for this part

Specification	44-647-10

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Phosphor Bronze
Convert From (Adapter End)	SOIC
Convert To (Adapter End)	15.24 mm
Convert To (Adapter End)	0.6 in
Convert To (Adapter End)	DIP
Current Rating (Amps)	3 A
Mounting Type	Through Hole
Number of Pins	44
Termination	Solder
Termination Post Length	0.18 in
Termination Post Length	4.57 mm

Part	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Current Rating (Amps)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Termination Post Length	Termination Post Length	Termination	Contact Finish - Post	Convert To (Adapter End)	Convert To (Adapter End)	Convert To (Adapter End)	Contact Finish - Mating	Convert From (Adapter End)	Number of Pins	Mounting Type
Aries Electronics 44-647-10	Phosphor Bronze	0.25 µm	10 µin	3 A	200 µin	5.08 µm	Beryllium Copper	0.18 in	4.57 mm	Solder	Tin	15.24 mm	0.6 in	DIP	Gold	SOIC	44	Through Hole

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

IC Socket Adapter SOIC To DIP, 0.6" (15.24mm) Row Spacing Through Hole

Technical documentation and resources