Integrated Circuits (ICs)

ADBF706WCCPZ411

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LOW POWER BLACKFIN+ EMBEDDED PRO

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Integrated Circuits (ICs)

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LOW POWER BLACKFIN+ EMBEDDED PRO

Technical Specifications

Parameters and characteristics for this part

Specification	ADBF706WCCPZ411

Clock Rate	400 MHz
Grade	Automotive
Interface	QSPI, DSPI, SPORT, I2C, UART/USART, PPI, CAN, USB OTG, SD/SDIO, SPI, EBI/EMI
Mounting Type	Surface Mount
Non-Volatile Memory	512 kB
On-Chip RAM	1 MB
Operating Temperature [Max]	105 °C
Operating Temperature [Min]	-40 °C
Package / Case	88-VFQFN Exposed Pad, CSP
Supplier Device Package	88-LFCSP-VQ (12x12)
Type	Blackfin+
Voltage - Core	1.1 V
Voltage - I/O	3.3 V, 1.8 V

Part	Mounting Type	Supplier Device Package	Non-Volatile Memory	Operating Temperature [Max]	Operating Temperature [Min]	Type	Grade	Voltage - I/O	Package / Case	Clock Rate	On-Chip RAM	Voltage - Core	Interface
Analog Devices ADBF706WCCPZ411	Surface Mount	88-LFCSP-VQ (12x12)	512 kB	105 °C	-40 °C	Blackfin+	Automotive	1.8 V 3.3 V	88-VFQFN Exposed Pad CSP	400 MHz	1 MB	1.1 V	CAN DSPI EBI/EMI I2C PPI QSPI SD/SDIO SPI SPORT UART/USART USB OTG

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General part information

LOW POWER BLACKFIN+ EMBEDDED PRO

Technical documentation and resources