Zenode.ai Logo
Beta
MICROCHIP KSZ8842-16MVLI
Integrated Circuits (ICs)

STM32G474QET6

Active
STMicroelectronics

MAINSTREAM ARM CORTEX-M4 MCU 170 MHZ WITH 512 KBYTES OF FLASH MEMORY, MATH ACCELERATOR, HR TIMER, HIGH ANALOG LEVEL INTEGRATION

Deep-Dive with AI

Search across all available documentation for this part.

MICROCHIP KSZ8842-16MVLI
Integrated Circuits (ICs)

STM32G474QET6

Active
STMicroelectronics

MAINSTREAM ARM CORTEX-M4 MCU 170 MHZ WITH 512 KBYTES OF FLASH MEMORY, MATH ACCELERATOR, HR TIMER, HIGH ANALOG LEVEL INTEGRATION

Technical Specifications

Parameters and characteristics for this part

SpecificationSTM32G474QET6
ConnectivityLINbus, QSPI, SPI, CANbus, I2C, IrDA, UART/USART
Core ProcessorARM® Cortex®-M4F
Core Size32-Bit
Data ConvertersA/D 42x12b, D/A 7x12b
Mounting TypeSurface Mount
Number of I/O107
Operating Temperature [Max]85 C
Operating Temperature [Min]-40 ¯C
Oscillator TypeInternal
Package / Case128-LQFP
PeripheralsPOR, WDT, PWM, Brown-out Detect/Reset, DMA, I2S
Program Memory Size512 KB
Program Memory TypeFLASH
RAM Size128 K
Speed170 MHz
Supplier Device Package128-LQFP (14x14)
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]1.71 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 1$ 9.46
10$ 7.35
50$ 6.74
100$ 6.03
DigikeyN/A 779$ 9.86
NewarkEach 1$ 9.96
10$ 7.79
25$ 6.68
50$ 6.49
180$ 6.30

Description

General part information

STM32G474QE Series

The STM32G474xB/xC/xE devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core. They operate at a frequency of up to 170 MHz.

The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all the Arm single-precision data-processing instructions and all the data types. It also implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances the application’s security.

These devices embed high-speed memories (up to 512 Kbytes of Flash memory, and 128 Kbytes of SRAM), a flexible external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), a Quad-SPI Flash memory interface, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.

Documents

Technical documentation and resources