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RQ3E120BNTB
Discrete Semiconductor Products

RQ3E120BNTB

Active
Rohm Semiconductor

MOSFET TRANSISTOR, N CHANNEL, 12 A, 30 V, 0.0066 OHM, 10 V, 2.5 V ROHS COMPLIANT: YES

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RQ3E120BNTB
Discrete Semiconductor Products

RQ3E120BNTB

Active
Rohm Semiconductor

MOSFET TRANSISTOR, N CHANNEL, 12 A, 30 V, 0.0066 OHM, 10 V, 2.5 V ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3E120BNTB
Current - Continuous Drain (Id) @ 25°C12 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]29 nC
Input Capacitance (Ciss) (Max) @ Vds1500 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs9.3 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2572$ 0.50
NewarkEach 1$ 0.50
10$ 0.43
100$ 0.33
500$ 0.27
1000$ 0.25
2500$ 0.24
10000$ 0.23

Description

General part information

RQ3E120BN Series

High power package RQ3E120BN is middle power MOSFET for switching application.

Documents

Technical documentation and resources

HSMT8 Single Cu Inner Structure

Package Information

List of Transistor Package Thermal Resistance

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

Anti-Whisker formation - Transistors

Package Information

Part Explanation

Application Note

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Taping Information

Package Information

Package Dimensions

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

How to Create Symbols for PSpice Models

Models

ESD Data

Characteristics Data

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Explanation for Marking

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

About Flammability of Materials

Environmental Data

RQ3E120BN Data Sheet

Data Sheet

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Condition of Soldering / Land Pattern Reference

Package Information

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Types and Features of Transistors

Application Note

What Is Thermal Design

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Compliance of the RoHS directive

Environmental Data

MOSFET Gate Resistor Setting for Motor Driving

Technical Article