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PMPB33XP,115
Discrete Semiconductor Products

PMPB33XP,115

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Nexperia USA Inc.

TRANS MOSFET P-CH 20V 5.5A 6-PIN DFN-MD EP T/R

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PMPB33XP,115
Discrete Semiconductor Products

PMPB33XP,115

Active
Nexperia USA Inc.

TRANS MOSFET P-CH 20V 5.5A 6-PIN DFN-MD EP T/R

Technical Specifications

Parameters and characteristics for this part

SpecificationPMPB33XP,115
Current - Continuous Drain (Id) @ 25°C5.5 A
Drain to Source Voltage (Vdss)20 V
Drive Voltage (Max Rds On, Min Rds On) [Max]1.8 V
Drive Voltage (Max Rds On, Min Rds On) [Min]4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs23 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]1575 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case6-UDFN Exposed Pad
Power Dissipation (Max)12.5 W, 1.7 W
Rds On (Max) @ Id, Vgs [Max]37 mOhm
Supplier Device PackageDFN2020MD-6
TechnologyMOSFET (Metal Oxide)
Vgs (Max)12 V
Vgs(th) (Max) @ Id900 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
ArrowN/A 3000$ 0.11
DigikeyN/A 6042$ 0.72

Description

General part information

PMPB33XP Series

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Documents

Technical documentation and resources

PMPB33XP,115 | Datasheet

Datasheet

小巧轻便的汽车 二极管和晶体管

Brochure

RC Thermal Models

Application note

Understanding power MOSFET data sheet parameters

Application note

Thermal performance of DFN packages

Application note

DFN2020MD-6; Reel pack for SMD, 7''; Q2/T3 product orientation

Packing information

Reflow soldering profile

Reflow soldering

Nexperia package poster

Leaflet

DFN2020MD-6; Reel pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,184 or Z Ordering code (12NC) ending 184

Packing information

Using power MOSFETs in parallel

Application note

Failure signature of Electrical Overstress on Power MOSFETs

Application note

Small & light automotive diodes and transistors

Leaflet

plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Marcom graphics

MOSFET load switch PCB with thermal measurement

Application note

plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body

Package information

Automatic Optical Inspection of DFN Components

Report

LFPAK MOSFET thermal design guide, Chinese version

Application note

Understanding power MOSFET data sheet parameters

Application note

Power MOSFET frequently asked questions and answers

Technical note

Questions about package outline drawings

Application note

LFPAK MOSFET thermal design guide - Part 2

Application note

Power MOSFET single-shot and repetitive avalanche ruggedness rating

Application note