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EasyPIM 2B
Discrete Semiconductor Products

F3L225R07W2H3PB63BPSA1

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INFINEON

THE F3L225R07W2H3P_B63 IS A 3-LEVEL IGBT HIGHSPEED 3 MODULE IN A EASYPACK™ 2B HOUSING FOR INDUSTRIAL APPLICATIONS UP TO 650 V AND 225 A.

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EasyPIM 2B
Discrete Semiconductor Products

F3L225R07W2H3PB63BPSA1

Active
INFINEON

THE F3L225R07W2H3P_B63 IS A 3-LEVEL IGBT HIGHSPEED 3 MODULE IN A EASYPACK™ 2B HOUSING FOR INDUSTRIAL APPLICATIONS UP TO 650 V AND 225 A.

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

SpecificationF3L225R07W2H3PB63BPSA1
ConfigurationSingle Switch
Current - Collector (Ic) (Max) [Max]225 A
Current - Collector Cutoff (Max) [Max]1 mA
InputStandard
Input Capacitance (Cies) @ Vce14 nF
Mounting TypeChassis Mount
NTC ThermistorTrue
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Supplier Device PackageAG-EASY2B
Vce(on) (Max) @ Vge, Ic1.75 V
Voltage - Collector Emitter Breakdown (Max) [Max]650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 55.29
18$ 52.97

Description

General part information

F3L225 Series

EasyPACK™ 2B650 V 225 A 3-level phase legIGBT modulewith High Speed IGBT H3, NTC, active "Neutral Point Clamp 2", PressFIT Contact Technology and pre-appliedThermal Interface Material.

Documents

Technical documentation and resources