Texas Instruments

The VSP3200 and VSP3210 are complete CCD image processors that operate from single +5V supplies. This complete image processor includes three Correlated Double Samplers (CDSs) and Programmable Gain Amplifiers (PGAs) to process CCD signals. The VSP3200 is interface compatible with the VSP3210, which is a 16-bit, one-chip product. The VSP3210 is pin-to-pin compatible with VSP3100, when in demultiplexed output mode. The VSP3200 and VSP3210 can be operated from 0°C to +85°C, and are available in LQFP-48 packages. The VSP3200 and VSP3210 are complete CCD image processors that operate from single +5V supplies. This complete image processor includes three Correlated Double Samplers (CDSs) and Programmable Gain Amplifiers (PGAs) to process CCD signals. The VSP3200 is interface compatible with the VSP3210, which is a 16-bit, one-chip product. The VSP3210 is pin-to-pin compatible with VSP3100, when in demultiplexed output mode. The VSP3200 and VSP3210 can be operated from 0°C to +85°C, and are available in LQFP-48 packages.

The VSP5324-Q1 device is a low-power, 12-bit, 80-MSPS, quad-channel, analog-to-digital converter (ADC). Low-power consumption and multiple-channel integration in a compact package makes the device attractive for 3D time-of-flight (ToF) systems. Serial low-voltage differential signaling (LVDS) outputs reduce the number of interface lines and enable high system integration. The device is available in a compact 9-mm × 9-mm VQFN-64 Package. The VSP5324-Q1 device is a low-power, 12-bit, 80-MSPS, quad-channel, analog-to-digital converter (ADC). Low-power consumption and multiple-channel integration in a compact package makes the device attractive for 3D time-of-flight (ToF) systems. Serial low-voltage differential signaling (LVDS) outputs reduce the number of interface lines and enable high system integration. The device is available in a compact 9-mm × 9-mm VQFN-64 Package.