LSM330LSM330DLC adapter board for standard DIL24 socket | Evaluation Boards | 5 | Active | The STEVAL-MKI122V1 is an adapter board designed to facilitate the evaluation of MEMS devices in the LSM330DLC product family. The board offers an effective solution for fast system prototyping and device evaluation directly within the user’s own application.
The STEVAL-MKI122V1 can be plugged into a standard DIL 24 socket. The adapter provides the complete LSM330DLC pinout and comes ready-to-use with the required decoupling capacitors on the VDDpower supply line.
This adapter is supported by the STEVAL-MKI109V2 and STEVAL-MKI109V3 motherboards which include a high performance 32-bit microcontroller functioning as a bridge between the sensor and a PC, on which it is possible to use the downloadable graphical user interface (Unico GUI), or dedicated software routines for customized applications. |
LSM6iNEMO 6DoF inertial measurement unit (IMU), for smart phones and battery operated IoT, Gaming, Wearable and Consumer Electronics. Ultra-low power and high accuracy | Development Boards, Kits, Programmers | 14 | Active | The LSM6DSOX is a 6-axis IMU (inertial measurement unit) system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSOX supports the main OS requirements, offering real, virtual, and batch sensors with 9 KB for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for the OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic, land grid array (LGA) package. |
| Evaluation Boards | 1 | Obsolete | |
LSM6DS3LSM6DS3H adapter board for standard DIL24 socket | Development Boards, Kits, Programmers | 2 | Obsolete | The STEVAL-MKI160V1 is an adapter board designed to facilitate the evaluation of MEMS inertial devices in the LSM6DS3 product family. The board offers an effective solution for fast system prototyping and device evaluation directly within the user's own application. The STEVAL-MKI160V1 can be plugged into a standard DIL24 socket. The adapter provides the complete LSM6DS3 pinout and comes ready to use with the required decoupling capacitors on the VDDpower supply line.
The DIL24 adapter is supported by the STEVAL-MKI109V2 and STEVAL-MKI109V3 motherboards and by the X-NUCLEO-IKS01A1 expansion board.
By using the STEVAL-MKI109V2 or STEVAL-MKI109V3, which include a STM32 Nucleo functioning as a bridge between the adapter and a PC, it is possible configure the LSM6DS3 sensor through Unico GUI (Graphical User Interface) or dedicated software routines for customized applications. |
LSM6DSO6-axis IMU (inertial measurement unit): always-on 3-axis accelerometer and 3-axis gyroscope | Motion Sensors | 1 | Active | The LSM6DSO is a 6-axis IMU (inertial measurement unit) system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.
The LSM6DSO supports the main OS requirements, offering real, virtual, and batch sensors with 9 KB for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit that is trimmed to better match the characteristics of the sensing element.
The LSM6DSO has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The LSM6DSO fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and an auxiliary SPI, configurable for both the gyroscope and accelerometer.
High robustness to mechanical shock makes the LSM6DSO the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO is available in a plastic, land grid array (LGA) package. |
LSM6DSO16IS6-axis IMU (inertial measurement unit): always-on 3-axis accelerometer and 3-axis gyroscope with ISPU (intelligent sensor processing unit) | IMUs (Inertial Measurement Units) | 2 | Active | The LSM6DSO16IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in personal electronics and IoT solutions.
The LSM6DSO16IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps. The module features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The LSM6DSO16IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rdparty tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any personal electronics, from wearable accessories to high-end applications.
The LSM6DSO16IS is available in a plastic land grid array (LGA) package. |
LSM6DSO32LSM6DSO32 adapter board for a standard DIL24 socket | Development Boards, Kits, Programmers | 1 | Active | The STEVAL-MKI215V1 is an adapter board designed to facilitate the evaluation of MEMS devices in the LSM6DSO32 product family. The board offers an effective solution for fast system prototyping and device evaluation directly within the user’s own application.
The STEVAL-MKI215V1 can be plugged into a standard DIL 24 socket. The adapter provides the complete LSM6DSO32pin-out and comes ready-to-use with the required decoupling capacitors on the VDD power supply line.
This adapter is supported by the STEVAL-MKI109V3 motherboard with high performance 32-bit microcontroller functioning as a bridge between the sensor and a PC, on which it is possible to use the downloadable graphical user interface (Unico GUI), or dedicated software routines for customized applications.
The adapter board can be also plugged into following boards: X-NUCLEO-IKS01A2, X-NUCLEO-IKS01A1 and X-NUCLEO-IKS01A3. |
LSM6DSO32XiNEMO inertial module: always-on 3D accelerometer and 3D gyroscope | Specialized Sensors | 1 | Active | The LSM6DSO32X is a system-in-package featuring a 3D digital accelerometer at 32 g and a 3D digital gyroscope, boosting power performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience in wearable, hard-fall detection, navigation and asset tracking applications.
The LSM6DSO32X supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LSM6DSO32X embeds a dedicated core for Machine Learning processing (MLC) and a Finite State Machine (FSM) that provides system flexibility, allowing some algorithms run in the application processor to be moved to the MEMS sensor with the advantage of consistent reduction in power consumption.
The LSM6DSO32X has a full-scale acceleration range of ±4/±8/±16/±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32X the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32X is available in a plastic land grid array (LGA) package. |
LSM6DSRiNEMO Inertial Module: 3D Accelerometer and 3D Gyroscope | Motion Sensors | 1 | Active | The LSM6DSR is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended full-scale range for the gyroscope, up to 4000 dps, and high stability over temperature and time.
The LSM6DSR supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes with FIFO compression up to three times for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The LSM6DSR has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps.
The LSM6DSR embeds a broad range of advanced functions supporting Android wearable sensors and programmable sensors (suitable for activity recognition).
The LSM6DSR is available in a plastic land grid array (LGA) package. |
LSM6DSRXiNEMO Inertial Module with Machine Learning Core, Finite State Machine and Advanced Digital Functions for High Accuracy Applications. | IMUs (Inertial Measurement Units) | 1 | Active | The LSM6DSRX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope with an extended full-scale range for the gyroscope, up to 4000 dps, and high stability over temperature and time.
The LSM6DSRX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes with FIFO compression up to three times for dynamic data batching.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes.
The LSM6DSRX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps.
The LSM6DSRX embeds a broad range of advanced functions supporting Android wearable sensors and programmable sensors (suitable for activity recognition).
The LSM6DSRX embeds a Machine Learning Core able to identify if a data pattern matches an activity in a user-defined set of classes, reducing power consumption and increasing performance of the sensor.
The LSM6DSRX is available in a plastic land grid array (LGA) package. |
