Microchip Technology

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

These bidirectional, high speed, voltage protection devices are ideally suited for applications where fast response is essential. The use of passivated die metallurgically bonded on both sides assures long term reliability. This series is especially useful in protecting microprocessors, MOS, CMOS, TTL, Schottky TTL, ECL, I2 L and linear integrated circuits from spurious transient disturbances including NEMP (Nuclear Electromagnetic Pulse) and electrostatic discharge.

The EQCO125X40 is a CoaXPress 2.0 Transmitter/Receiver with integrated equalizer, CDR (reclocker) and Cable Driver. It is designed to transmit/receive signals on a single cable or PCB trace pair. In one direction an 8b/10b coded downlink signal is transmitted/received between 1.25 Gbps and 12.5 Gbps. In the opposite direction a lower speed 8b/10b coded uplink signal is transmitted/received at 20.833 Mbps or 41.666 Mbps. The EQCO125X40 can be used as a CoaXPress transmitter inside a camera, as a CoaXPress receiver inside a frame grabber and as a CoaXPress repeater inside an active coax cable or link. To compare this product to other Microchip CoaXPress 2.0 offerings, please see the [**CoaXPress 2.0 Product Comparison**](https://www.microchip.com/en-us/products/high-speed-networking-and-video/data-and-video-transceivers/supported-video-protocols/coaxpress-technology#compare-products) table.