30-9513 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Type	Type	Type	Contact Material - Post [custom]	Contact Material - Mating	Contact Finish - Post	Pitch - Post	Pitch - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Finish - Mating	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 30-9513-10T	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Brass	Beryllium Copper	Tin	0.1 in	2.54 mm	Through Hole	0.1 "	2.54 mm	Solder	200 µin	5.08 µm	Closed Frame	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	0.25 µm	10 µin	30	15	2
Aries Electronics 30-9513-11	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Brass	Beryllium Copper	Gold	0.1 in	2.54 mm	Through Hole	0.1 "	2.54 mm	Solder	10 Áin	0.25 çm	Closed Frame	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	0.25 µm	10 µin	30	15	2
Aries Electronics 30-9513-10H	UL94 V-0	0.125 in	3.18 mm	3 A	DIP	22.86 mm	0.9 in	Brass	Beryllium Copper	Tin	0.1 in	2.54 mm	Through Hole	0.1 "	2.54 mm	Solder	200 µin	5.08 µm	Closed Frame	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	-55 C	105 ░C	0.25 µm	10 µin	30	15	2