44-6554 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Type	Type	Features	Pitch - Post	Pitch - Post	Contact Material - Post	Contact Material - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Pitch - Mating	Pitch - Mating	Housing Material	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 44-6554-16	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	2 22	44	Nickel Boron	Solder	1.27 µm	50 µin	Nickel Boron	50 µin	1.27 µm	Through Hole	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-6554-11	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	2 22	44	Gold	Solder			Gold			Through Hole	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-6554-10	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 in	2.54 mm	Beryllium Copper	Beryllium Copper	2 22	44	Tin	Solder	5.08 µm	200 µin		200 µin	5.08 µm	Through Hole	0.1 "	2.54 mm	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-6554-18	UL94 V-0	1 A	0.11 in	2.78 mm	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	0.1 in	2.54 mm	Beryllium Nickel	Beryllium Nickel	2 22	44	Nickel Boron	Solder	1.27 µm	50 µin	Nickel Boron	50 µin	1.27 µm	Through Hole	0.1 "	2.54 mm	Polyetheretherketone (PEEK) Glass Filled	-55 C	250 °C