36-0518 Series

Catalog

CONN SOCKET SIP 36POS GOLD

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Pitch - Mating	Pitch - Mating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Contact Material - Post [custom]	Contact Finish - Post	Mounting Type	Type
Aries Electronics 36-0518-10H	3 A	0.125 in	3.18 mm	UL94 V-0	Open Frame	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Tin	Through Hole	SIP
Aries Electronics 36-0518-10T	3 A	0.125 in	3.18 mm	UL94 V-0	Open Frame	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Tin	Through Hole	SIP
Aries Electronics 36-0518-11H	3 A	0.125 in	3.18 mm	UL94 V-0	Open Frame	10 Áin	0.25 çm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Gold	Through Hole	SIP
Aries Electronics 36-0518-00	3 A	0.046 in	1.17 mm	UL94 V-0	Open Frame	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Tin	Surface Mount	SIP
Aries Electronics 36-0518-11	3 A	0.125 in	3.18 mm	UL94 V-0	Open Frame	10 Áin	0.25 çm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Gold	Through Hole	SIP
Aries Electronics 36-0518-10	3 A	0.125 in	3.18 mm	UL94 V-0	Open Frame	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	36	1	36	Beryllium Copper	0.1 in	2.54 mm	Gold	Brass	Tin	Through Hole	SIP