20-3518 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Contact Material - Mating	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Type	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features	Contact Material - Post [custom]	Housing Material
Aries Electronics 20-3518-102	0.125 in	3.18 mm	UL94 V-0	3 A	Tin	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	200 µin	5.08 µm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-10M	0.125 in	3.18 mm	UL94 V-0	3 A	Tin	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	200 µin	5.08 µm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-112	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	10 Áin	0.25 çm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-10	0.125 in	3.18 mm	UL94 V-0	3 A	Tin	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	200 µin	5.08 µm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-10T	0.125 in	3.18 mm	UL94 V-0	3 A	Tin	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	200 µin	5.08 µm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-11	0.125 in	3.18 mm	UL94 V-0	3 A	Gold	Through Hole	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	10 Áin	0.25 çm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled
Aries Electronics 20-3518-00	0.125 in	3.18 mm	UL94 V-0	3 A	Tin	Surface Mount	0.1 "	2.54 mm	Gold	Beryllium Copper	Solder	0.25 µm	10 µin	7.62 mm	0.3 in	DIP	20	0.1 in	2.54 mm	200 µin	5.08 µm	Open Frame	Brass	Polyamide (PA46) Nylon 4/6 Glass Filled