50-9508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 50POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Type | Type | Type | Contact Material - Mating | Termination | Contact Material - Post [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [y] | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Features | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.5 in | 12.7 mm | DIP | 22.86 mm | 0.9 in | Beryllium Copper | Wire Wrap | Brass | 0.76 Ám | 30 Áin | Gold | 2 | 50 | 25 | Through Hole | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Tin | Open Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | DIP | 22.86 mm | 0.9 in | Beryllium Copper | Wire Wrap | Brass | 0.76 Ám | 30 Áin | Gold | 2 | 50 | 25 | Through Hole | 10 Áin | 0.25 çm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 125 °C | Gold | Open Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 3 A | 0.36 in | 9.14 mm | DIP | 22.86 mm | 0.9 in | Beryllium Copper | Wire Wrap | Brass | 0.76 Ám | 30 Áin | Gold | 2 | 50 | 25 | Through Hole | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled | -55 C | 105 ░C | Tin | Open Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |