20-0518 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 20POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Termination | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Features | Housing Material | Contact Finish - Mating | Contact Material - Post [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Tin | Solder | Beryllium Copper | 0.25 µm | 10 µin | Through Hole | 0.1 " | 2.54 mm | 20 | Open Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Brass |
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Tin | Solder | Beryllium Copper | 0.25 µm | 10 µin | Through Hole | 0.1 " | 2.54 mm | 20 | Open Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Brass |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | SIP | 0.1 in | 2.54 mm | 10 Áin | 0.25 çm | Gold | Solder | Beryllium Copper | 0.25 µm | 10 µin | Through Hole | 0.1 " | 2.54 mm | 20 | Open Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | Brass |