24-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Features	Type	Type	Contact Material - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post
Aries Electronics 24-6574-11	1 A	UL94 V-0	0.11 in	2.78 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.1 "	2.54 mm	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper	12	2	24	0.1 in	2.54 mm
Aries Electronics 24-6574-18	1 A	UL94 V-0	0.11 in	2.78 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.1 "	2.54 mm	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper	12	2	24	0.1 in	2.54 mm
Aries Electronics 24-6574-10	1 A	UL94 V-0	0.11 in	2.78 mm	Through Hole	Beryllium Copper	200 µin	5.08 µm	Tin	Solder	0.1 "	2.54 mm	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper	12	2	24	0.1 in	2.54 mm