40-6553 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 40POS GLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Number of Positions or Pins (Grid) | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Housing Material | Contact Finish - Mating | Contact Material - Post | Termination | Type | Type | Contact Material - Mating | Features | Pitch - Post | Pitch - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 40 | Gold | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Gold | Beryllium Copper | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Through Hole | ||||
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 40 | Nickel Boron | 0.1 " | 2.54 mm | Polyphenylene Sulfide (PPS) Glass Filled | Nickel Boron | Beryllium Copper | Solder | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | Closed Frame | 0.1 in | 2.54 mm | Through Hole | 1.27 µm | 50 µin | 50 µin | 1.27 µm |