10-2513 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 10POS GOLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Housing Material | Contact Material - Mating | Operating Temperature [Min] | Operating Temperature [Max] | Features | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Contact Material - Post [custom] | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | -55 C | 105 ░C | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 5 | 10 | 2 | DIP | 5.08 mm | 0.25 µm | 10 µin | Solder | Brass | Tin |
Aries Electronics | 0.125 in | 3.18 mm | UL94 V-0 | 3 A | Through Hole | Gold | 200 µin | 5.08 µm | Polyamide (PA46) Nylon 4/6 Glass Filled | Beryllium Copper | -55 C | 105 ░C | Closed Frame | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 5 | 10 | 2 | DIP | 5.08 mm | 0.25 µm | 10 µin | Solder | Brass | Tin |