40-3513 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 40POS GOLD
| Part | Material Flammability Rating | Current Rating (Amps) | Termination Post Length | Termination Post Length | Features | Housing Material | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Termination | Mounting Type | Contact Material - Mating | Contact Material - Post [custom] | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 40 | Solder | Through Hole | Beryllium Copper | Brass | Gold | -55 C | 105 ░C | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP |
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | 10 Áin | 0.25 çm | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 40 | Solder | Through Hole | Beryllium Copper | Brass | Gold | -55 C | 105 ░C | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP |
Aries Electronics | UL94 V-0 | 3 A | 0.125 in | 3.18 mm | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | Gold | 200 µin | 5.08 µm | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm | 40 | Solder | Through Hole | Beryllium Copper | Brass | Tin | -55 C | 105 ░C | 0.25 µm | 10 µin | 7.62 mm | 0.3 in | DIP |