24-4508 Series

Catalog

CONN IC DIP SOCKET 24POS GOLD

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating	Contact Material - Post [custom]	Features	Pitch - Mating	Pitch - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Type	Type	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Termination	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 24-4508-21	9.14 mm	0.36 in	3 A	UL94 V-0	Beryllium Copper	Brass	Open Frame	0.1 "	2.54 mm	Through Hole	10 Áin	0.25 çm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.76 Ám	30 Áin	0.4 in	DIP	0.1 in	2.54 mm	12	2	24	Wire Wrap	Gold	-55 C	125 °C
Aries Electronics 24-4508-31	12.7 mm	0.5 in	3 A	UL94 V-0	Beryllium Copper	Brass	Open Frame	0.1 "	2.54 mm	Through Hole	10 Áin	0.25 çm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.76 Ám	30 Áin	0.4 in	DIP	0.1 in	2.54 mm	12	2	24	Wire Wrap	Gold	-55 C	125 °C
Aries Electronics 24-4508-20	9.14 mm	0.36 in	3 A	UL94 V-0	Beryllium Copper	Brass	Open Frame	0.1 "	2.54 mm	Through Hole	200 µin	5.08 µm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.76 Ám	30 Áin	0.4 in	DIP	0.1 in	2.54 mm	12	2	24	Wire Wrap	Tin	-55 C	105 ░C
Aries Electronics 24-4508-30	12.7 mm	0.5 in	3 A	UL94 V-0	Beryllium Copper	Brass	Open Frame	0.1 "	2.54 mm	Through Hole	200 µin	5.08 µm	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.76 Ám	30 Áin	0.4 in	DIP	0.1 in	2.54 mm	12	2	24	Wire Wrap	Tin	-55 C	105 ░C