FAM65CR51XZ Series

Power Integrated Module (PIM) Boost Converter Stage for Multiphase and Semi-Bridgeless PFC

Catalog

Power Integrated Module (PIM) Boost Converter Stage for Multiphase and Semi-Bridgeless PFC

Part	Drain to Source Voltage (Vdss)	Supplier Device Package	Technology	Operating Temperature [Min]	Operating Temperature [Max]	Grade	Rds On (Max) @ Id, Vgs	Input Capacitance (Ciss) (Max) @ Vds	Mounting Type	Vgs(th) (Max) @ Id	Current - Continuous Drain (Id) @ 25°C	Gate Charge (Qg) (Max) @ Vgs [Max]	Configuration	Qualification	Power - Max [Max]	Package / Case
ON Semiconductor FAM65CR51XZ1	650 V	APMCA-A16	MOSFET (Metal Oxide)	-55 °C	150 °C	Automotive	51 mOhm	4864 pF	Through Hole	5 V	64 A	123 nC	2 N-Channel	AEC-Q101	463 W	12-SSIP Exposed Pad Formed Leads
ON Semiconductor FAM65CR51XZ2	650 V	APMCD-B16	MOSFET (Metal Oxide)	-55 °C	150 °C	Automotive	51 mOhm	4864 pF	Through Hole	5 V	64 A	123 nC	2 N-Channel	AEC-Q101	463 W	12-SSIP Exposed Pad Formed Leads

Catalog

Power Integrated Module (PIM) Boost Converter Stage for Multiphase and Semi-Bridgeless PFC

Key Features

• Integrated SIP or DIP Boost Converter Stage Power Module for On−board Charger (OBC) in EV−PHEV

• 5 kV/1 sec Electrically Isolated Substrate for Easy Assembly

• Compact Design for Low Total Module Resistance

• Module Serialization for Full Traceability

• Pb Free, RoHS and UL94V−0 Compliant

• AEC Q101 and AQG324 Qualified and PPAP capable

Description

Automotive Power Module in Totem Pole configuration using 51mOhm SuperFET3 MOSFET and Stealth(TM) Diodes for usage in PFC stages of OBC systems.This high power version uses AlN substrate material for extreme thermal performance.