32-C212 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Termination	Contact Material - Post [custom]	Contact Finish - Post	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Number of Positions or Pins (Grid)	Type [custom]	Type [custom]	Type	Contact Finish - Mating	Contact Material - Mating	Features
Aries Electronics 32-C212-30	3 A	UL94 V-0	0.04 in	1.02 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	Wire Wrap	Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	200 µin	5.08 µm	-55 C	105 ░C	Through Hole	32	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	Closed Frame
Aries Electronics 32-C212-00	3 A	UL94 V-0	0.04 in	1.02 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	Solder	Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	200 µin	5.08 µm	-55 C	105 ░C	Surface Mount	32	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	Closed Frame
Aries Electronics 32-C212-10	3 A	UL94 V-0	0.125 in	3.18 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	Solder	Brass	Tin	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	200 µin	5.08 µm	-55 C	105 ░C	Through Hole	32	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	Closed Frame
Aries Electronics 32-C212-31	3 A	UL94 V-0	0.04 in	1.02 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	Wire Wrap	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	10 Áin	0.25 çm	-55 C	125 °C	Through Hole	32	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	Closed Frame
Aries Electronics 32-C212-21	3 A	UL94 V-0	0.04 in	1.02 mm	0.1 "	2.54 mm	0.1 in	2.54 mm	Wire Wrap	Brass	Gold	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	10 Áin	0.25 çm	-55 C	125 °C	Through Hole	32	15.24 mm	0.6 in	DIP	Gold	Beryllium Copper	Closed Frame