16-C280 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Finish - Post	Contact Material - Mating	Type	Type	Type	Mounting Type	Housing Material	Features	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Termination	Contact Material - Post [custom]	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 16-C280-11H	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Gold	2	16	8	Solder	Brass	0.1 "	2.54 mm	10 Áin	0.25 çm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-21	UL94 V-0	0.04 in	1.02 mm	3 A	Gold	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Gold	2	16	8	Wire Wrap	Brass	0.1 "	2.54 mm	10 Áin	0.25 çm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-00	UL94 V-0	0.04 in	1.02 mm	3 A	Tin	Beryllium Copper	7.62 mm	0.3 in	DIP	Surface Mount	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Gold	2	16	8	Solder	Brass	0.1 "	2.54 mm	200 µin	5.08 µm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-20	UL94 V-0	0.04 in	1.02 mm	3 A	Tin	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Gold	2	16	8	Wire Wrap	Brass	0.1 "	2.54 mm	200 µin	5.08 µm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-30	UL94 V-0	0.04 in	1.02 mm	3 A	Tin	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Gold	2	16	8	Wire Wrap	Brass	0.1 "	2.54 mm	200 µin	5.08 µm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-11	UL94 V-0	0.125 in	3.18 mm	3 A	Gold	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Gold	2	16	8	Solder	Brass	0.1 "	2.54 mm	10 Áin	0.25 çm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-31	UL94 V-0	0.04 in	1.02 mm	3 A	Gold	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	125 °C	Gold	2	16	8	Wire Wrap	Brass	0.1 "	2.54 mm	10 Áin	0.25 çm	0.1 in	2.54 mm	0.25 µm	10 µin
Aries Electronics 16-C280-10	UL94 V-0	0.125 in	3.18 mm	3 A	Tin	Beryllium Copper	7.62 mm	0.3 in	DIP	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	Closed Frame	-55 C	105 ░C	Gold	2	16	8	Solder	Brass	0.1 "	2.54 mm	200 µin	5.08 µm	0.1 in	2.54 mm	0.25 µm	10 µin