18-0513 Series

Catalog

CONN SOCKET SIP 18POS GOLD

Part	Material Flammability Rating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating	Pitch - Mating	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Contact Finish - Mating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Contact Finish - Post	Contact Material - Mating	Termination
Aries Electronics 18-0513-11H	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	0.1 "	2.54 mm	SIP	18	18	1	Gold	Through Hole	10 Áin	0.25 çm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Brass	Gold	Beryllium Copper	Solder
Aries Electronics 18-0513-10	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	0.1 "	2.54 mm	SIP	18	18	1	Gold	Through Hole	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Brass	Tin	Beryllium Copper	Solder
Aries Electronics 18-0513-10T	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	0.1 "	2.54 mm	SIP	18	18	1	Gold	Through Hole	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Brass	Tin	Beryllium Copper	Solder
Aries Electronics 18-0513-10H	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	0.1 "	2.54 mm	SIP	18	18	1	Gold	Through Hole	200 µin	5.08 µm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Brass	Tin	Beryllium Copper	Solder
Aries Electronics 18-0513-11	UL94 V-0	3 A	0.125 in	3.18 mm	0.25 µm	10 µin	0.1 "	2.54 mm	SIP	18	18	1	Gold	Through Hole	10 Áin	0.25 çm	Polyamide (PA46) Nylon 4/6 Glass Filled	0.1 in	2.54 mm	Brass	Gold	Beryllium Copper	Solder