40-6571 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 40POS TIN
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Material - Post | Housing Material | Number of Positions or Pins (Grid) | Termination | Contact Finish - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Mounting Type | Type | Type | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 40 | Solder | Tin | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Through Hole | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | 200 µin | 5.08 µm | Closed Frame | 5.08 µm | 200 µin | |
Aries Electronics | 1 A | 0.11 in | 2.78 mm | UL94 V-0 | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | 40 | Solder | Gold | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Through Hole | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Beryllium Copper | 10 Áin | 0.25 çm | Closed Frame | 0.25 µm | 10 µin | Gold |