NC7SP08 Series

TinyLogic ULP 2-Input AND Gate

Catalog

TinyLogic ULP 2-Input AND Gate

Part	Number of Inputs	Package / Case	Operating Temperature [Max]	Operating Temperature [Min]	Max Propagation Delay @ V, Max CL	Logic Type	Mounting Type	Input Logic Level - High [Min]	Input Logic Level - High [Max]	Current - Quiescent (Max) [Max]	Current - Output High, Low [custom]	Current - Output High, Low [custom]	Voltage - Supply [Max]	Voltage - Supply [Min]	Number of Circuits	Supplier Device Package
ON Semiconductor NC7SP08L6X	2	6-UFDFN	85 °C	-40 °C	9.2 ns	AND Gate	Surface Mount	1.6 V	2.1 V	900 nA	2.6 mA	2.6 mA	3.6 V	0.9 V	1	6-MicroPak
ON Semiconductor NC7SP08P5X	2	5-TSSOP SC-70-5 SOT-353	85 °C	-40 °C	9.2 ns	AND Gate	Surface Mount	1.6 V	2.1 V	900 nA	2.6 mA	2.6 mA	3.6 V	0.9 V	1	SC-70-5

Catalog

TinyLogic ULP 2-Input AND Gate

Key Features

• 0.9V to 3.6V VCCSupply Operation

• 3.6V Over-Voltage Tolerant I/Os at VCCfrom 0.9V to 3.6V

• Extremely High Speed tPD

• 2.5ns: Typical for 3.0V to 3.6V VCC

• 5.0ns: Typical for 2.3V to 2.7V VCC

• 6.0ns: Typical for 1.65V to 1.95V VCC

• 7.0ns: Typical for 1.40V to 1.60V VCC

• 11.0ns: Typical for 1.10V to 1.30V VCC

• 27.0ns: Typical for 0.90V VCC

• Power-Off High-Impedance Inputs and Outputs

• High Static Drive (IOH/IOL)

• ±2.6mA at 3.00V VCC

• ±2.1mA at 2.30V VCC

• ±1.5mA at 1.65V VCC

• ±1.0mA at 1.40V VCC

• ±20µA at 0.90V VCC

• ±0.5mA at 1.10V VCC

• Ultra-Small MicroPak™ Packages

• Uses Proprietary Quiet Series™ Noise/EMI Reduction Circuitry

• Ultra-Low Dynamic Power

Description

The NC7SP08 is a single two-input AND gate from ON Semiconductor’s Ultra Low Power (ULP) series of TinyLogic®. Ideal for applications where battery life is critical, this product is designed for ultra low power consumption within the VCCoperating range of 0.9V to 3.6V. The internal circuit is composed of a minimum of inverter stages, including the output buffer, to enable ultra low static and dynamic power. The NC7SP08, for lower drive requirements, is uniquely designed for optimized power and speed and is fabricated with an advanced CMOS technology to achieve best-in-class speed of operation, while maintaining extremely low CMOS power dissipation.