44-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Features	Type	Type	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Material - Mating	Contact Finish - Post	Contact Material - Post	Housing Material	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post
Aries Electronics 44-6575-11	0.11 in	2.78 mm	UL94 V-0	1 A	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	2 22	44	Beryllium Copper	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	5.08 µm	200 µin	0.1 in	2.54 mm
Aries Electronics 44-6575-18	0.11 in	2.78 mm	UL94 V-0	1 A	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	2 22	44	Beryllium Copper	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	5.08 µm	200 µin	0.1 in	2.54 mm
Aries Electronics 44-6575-10	0.11 in	2.78 mm	UL94 V-0	1 A	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	2 22	44	Beryllium Copper	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	5.08 µm	200 µin	0.1 in	2.54 mm
Aries Electronics 44-6575-16	0.11 in	2.78 mm	UL94 V-0	1 A	Closed Frame	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Solder	0.1 "	2.54 mm	200 µin	5.08 µm	2 22	44	Beryllium Copper	Tin	Beryllium Copper	Polyphenylene Sulfide (PPS) Glass Filled	Through Hole	5.08 µm	200 µin	0.1 in	2.54 mm