APTGL475SK120D3G-Module Series

1200V/Single switch + series diode/IGBT

Catalog

1200V/Single switch + series diode/IGBT

Part	Operating Temperature [Min]	Operating Temperature [Max]	Package / Case	Current - Collector Cutoff (Max) [Max]	Vce(on) (Max) @ Vge, Ic	IGBT Type	Input	Current - Collector (Ic) (Max) [Max]	Power - Max [Max]	Mounting Type	Voltage - Collector Emitter Breakdown (Max) [Max]	Input Capacitance (Cies) @ Vce	Supplier Device Package	Configuration
Microchip Technology APTGL475U120DAG	-40 C	175 °C	SP6	4 mA	2.2 V	Trench Field Stop	Standard	610 A	2307 W	Chassis Mount	1200 V	24.6 nF	SP6	Single
Microchip Technology APTGL475SK120D3G	-40 C	175 °C	D-3 Module	5 mA	2.2 V	Trench Field Stop	Standard	610 A	2080 W	Chassis Mount	1200 V	24.6 nF	D3	Single
Microchip Technology APTGL475U120D4G	-40 C	175 °C	D4	4 mA	2.2 V	Trench Field Stop	Standard	610 A	2082 W	Chassis Mount	1200 V	24.6 nF	D4	Single
Microchip Technology APTGL475A120D3G	-40 C	175 °C	D-3 Module	5 mA	2.2 V	Trench Field Stop	Standard	610 A	2080 W	Chassis Mount	1200 V	24.6 nF	D3	Half Bridge
Microchip Technology APTGL475DA120D3G	-40 C	175 °C	D-3 Module	5 mA	2.2 V	Trench Field Stop	Standard	610 A	2080 W	Chassis Mount	1200 V	24.6 nF	D3	Single

Catalog

1200V/Single switch + series diode/IGBT

Key Features

• * Configuration: Single switch + series diodes

• * VCES (V): 1200

• * VCESat (V): 1.85

• * Current (A) Tc=80C: 475

• * Silicon type: TRENCH 4 IGBT

• * Package: SP6C

Description

* IGBT 4 * Very Low voltage drop * Low tail current * Low leakage current * Kelvin emitter for easy drive * Low stray inductance * High level of integration * Stable temperature behavior * Very rugged * Direct mounting to heatsink (isolated package) * Low junction to case thermal resistance * Internal thermistor for temperature monitoring (optional) * Easy paralleling due to positive TC of VCEsat * Low profile * RoHS Compliant