40-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Termination	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Contact Material - Post	Type	Type	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Mounting Type	Contact Finish - Mating
Aries Electronics 40-3570-10	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	Beryllium Copper	200 µin	5.08 µm	40	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in	Tin	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	5.08 µm	200 µin	Closed Frame	Through Hole
Aries Electronics 40-3570-11	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	Beryllium Copper	10 Áin	0.25 çm	40	Beryllium Copper	DIP ZIF (ZIP)	7.62 mm	0.3 in	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	0.25 µm	10 µin	Closed Frame	Through Hole	Gold
Aries Electronics 40-3570-16	1 A	UL94 V-0	0.11 in	2.78 mm	Solder	0.1 in	2.54 mm	Beryllium Nickel	50 µin	1.27 µm	40	Beryllium Nickel	DIP ZIF (ZIP)	7.62 mm	0.3 in	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	0.1 "	2.54 mm	1.27 µm	50 µin	Closed Frame	Through Hole	Nickel Boron