28-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS GLD

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Termination	Contact Material - Mating	Features	Number of Positions or Pins (Grid)	Type	Type	Type	Housing Material	Contact Finish - Mating	Mounting Type	Pitch - Mating	Pitch - Mating
Aries Electronics 28-3575-11	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	10 Áin	0.25 çm	0.25 µm	10 µin	Gold	Solder	Beryllium Copper	Closed Frame	28	DIP ZIF (ZIP)	7.62 mm	0.3 in	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	0.1 "	2.54 mm
Aries Electronics 28-3575-10	1 A	UL94 V-0	0.11 in	2.78 mm	Beryllium Copper	0.1 in	2.54 mm	10 Áin	0.25 çm	0.25 µm	10 µin	Gold	Solder	Beryllium Copper	Closed Frame	28	DIP ZIF (ZIP)	7.62 mm	0.3 in	Polyphenylene Sulfide (PPS) Glass Filled	Gold	Through Hole	0.1 "	2.54 mm