0503 Series

Catalog

IC & COMPONENT SOCKETS PIN LINE COLLET SCKT WIRE WRAP 1 PIN

Part	Current Rating (Amps)	Material Flammability Rating	Termination Post Length	Termination Post Length	Contact Material - Mating	Housing Material	Contact Finish - Post	Contact Material - Post [custom]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Number of Positions or Pins (Grid)	Termination	Mounting Type	Type	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [x]	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [x]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]
Aries Electronics 01-0503-21	3 A	UL94 HB	9.14 mm	0.36 in	Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Gold	Brass	10 Áin	0.25 çm	0.76 Ám	30 Áin	Gold	1 (1 x 1)	Wire Wrap	Through Hole	SIP
Aries Electronics 07-0503-21					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Gold	Brass	10 Áin	0.25 çm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP	7	7	1	0.1 in	2.54 mm	0.1 "	2.54 mm
Aries Electronics 18-0503-20	3 A	UL94 HB	9.14 mm	0.36 in	Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Tin	Brass	200 µin	5.08 µm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP				0.1 in	2.54 mm	0.1 "	2.54 mm	18	18	1
Aries Electronics 09-0503-21					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Gold	Brass	10 Áin	0.25 çm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP		9		0.1 in	2.54 mm	0.1 "	2.54 mm
Aries Electronics 25-0503-21					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Gold	Brass	10 Áin	0.25 çm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP		25		0.1 in	2.54 mm	0.1 "	2.54 mm		1	25
Aries Electronics 21-0503-30	3 A	UL94 HB	12.7 mm	0.5 in	Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Tin	Brass	200 µin	5.08 µm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP		21		0.1 in	2.54 mm	0.1 "	2.54 mm
Aries Electronics 06-0503-30					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Tin	Brass	200 µin	5.08 µm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP				0.1 in	2.54 mm	0.1 "	2.54 mm
Aries Electronics 13-0503-21					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Gold	Brass	10 Áin	0.25 çm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP				0.1 in	2.54 mm	0.1 "	2.54 mm		13	1	13
Aries Electronics 04-0503-30					Beryllium Copper	Glass Filled Nylon Polyamide (PA)	Tin	Brass	200 µin	5.08 µm	0.76 Ám	30 Áin	Gold		Wire Wrap	Through Hole	SIP		4 pins		0.1 in	2.54 mm	0.1 "	2.54 mm					1 x 4