48-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Pitch - Post	Pitch - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Finish - Post	Mounting Type	Housing Material	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Type	Contact Material - Post
Aries Electronics 48-6575-11	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	Closed Frame	0.25 µm	10 µin	2	48	24	Gold	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	10 Áin	0.25 çm	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper
Aries Electronics 48-6575-10	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	Closed Frame	0.25 µm	10 µin	2	48	24	Gold	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	10 Áin	0.25 çm	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper
Aries Electronics 48-6575-16	0.11 in	2.78 mm	UL94 V-0	1 A	Gold	0.1 "	2.54 mm	0.1 in	2.54 mm	Closed Frame	0.25 µm	10 µin	2	48	24	Gold	Through Hole	Polyphenylene Sulfide (PPS) Glass Filled	Solder	10 Áin	0.25 çm	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Beryllium Copper