44-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS TIN

Part	Termination Post Length	Termination Post Length	Current Rating (Amps)	Material Flammability Rating	Mounting Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Features	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Finish - Post	Contact Material - Mating	Pitch - Post	Pitch - Post	Type	Type	Type
Aries Electronics 44-3575-10	0.11 in	2.78 mm	1 A	UL94 V-0	Through Hole	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Beryllium Copper	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	2 22	44	Tin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in
Aries Electronics 44-3575-16	0.11 in	2.78 mm	1 A	UL94 V-0	Through Hole	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Beryllium Copper	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	2 22	44	Tin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in
Aries Electronics 44-3575-11	0.11 in	2.78 mm	1 A	UL94 V-0	Through Hole	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Beryllium Copper	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	2 22	44	Tin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in
Aries Electronics 44-3575-18	0.11 in	2.78 mm	1 A	UL94 V-0	Through Hole	200 µin	5.08 µm	Solder	0.1 "	2.54 mm	Beryllium Copper	5.08 µm	200 µin	Polyphenylene Sulfide (PPS) Glass Filled	Closed Frame	2 22	44	Tin	Beryllium Copper	0.1 in	2.54 mm	DIP ZIF (ZIP)	7.62 mm	0.3 in