25-0503 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN SOCKET SIP 25POS GOLD
| Part | Current Rating (Amps) | Termination Post Length | Termination Post Length | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Contact Material - Mating | Type | Pitch - Post | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Termination | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [x] | Housing Material | Pitch - Mating | Pitch - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 HB | Through Hole | Gold | Beryllium Copper | SIP | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | 0.76 Ám | 30 Áin | Brass | Wire Wrap | 1 | 25 | 25 | Glass Filled Nylon Polyamide (PA) | 0.1 " | 2.54 mm |
 Aries Electronics | 3 A | 0.5 in | 12.7 mm | UL94 HB | Through Hole | Gold | Beryllium Copper | SIP | 0.1 in | 2.54 mm | Gold | 10 Áin | 0.25 çm | 0.76 Ám | 30 Áin | Brass | Wire Wrap | 1 | 25 | 25 | Glass Filled Nylon Polyamide (PA) | 0.1 " | 2.54 mm |
Aries Electronics | 3 A | 0.36 in | 9.14 mm | UL94 HB | Through Hole | Gold | Beryllium Copper | SIP | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | 0.76 Ám | 30 Áin | Brass | Wire Wrap | 1 | 25 | 25 | Glass Filled Nylon Polyamide (PA) | 0.1 " | 2.54 mm |