28-3554 Series
Manufacturer: Aries Electronics
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⌘K
CONN IC DIP SOCKET ZIF 24POS
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Number of Positions or Pins (Grid) [x] | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) | Type | Type | Type | Contact Material - Mating | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Termination | Housing Material | Contact Material - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Copper | Through Hole | 50 µin | 1.27 µm | Nickel Boron | Solder | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | 1.27 µm | 50 µin | Closed Frame | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Nickel Boron | -55 C | 250 °C |
Aries Electronics | UL94 V-0 | 0.11 in | 2.78 mm | 1 A | 12 | 2 | 24 | DIP ZIF (ZIP) | 7.62 mm | 0.3 in | Beryllium Nickel | Through Hole | 50 µin | 1.27 µm | Nickel Boron | Solder | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | 1.27 µm | 50 µin | Closed Frame | 0.1 in | 2.54 mm | 0.1 " | 2.54 mm | Nickel Boron | -55 C | 250 °C |