DF12 (4.0) Series
Manufacturer: Hirose Electric Co Ltd
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⌘K
CONN HDR 30POS SMD GOLD
| Part | Mated Stacking Heights | Features | Pitch | Pitch | Number of Positions | Connector Type | Mounting Type | Height Above Board [z] | Height Above Board [z] | Contact Finish | Contact Finish Thickness | Contact Finish Thickness | Number of Rows [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | 30 | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 0.203 çm | 8 µin | 2 |
 Hirose Electric Co Ltd | |||||||||||||
 Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 0.203 çm | 8 µin | 2 | |
 Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | 50 | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 0.203 çm | 8 µin | 2 |
 Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | 40 | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 0.203 çm | 8 µin | 2 |
 Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | 20 | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 0.203 çm | 8 µin | 2 |
Hirose Electric Co Ltd | 4 mm | Board Guide Solder Retention | 0.02 " | 0.5 mm | 30 | Header Outer Shroud Contacts | Surface Mount | 3.3 mm | 0.13 in | Gold | 2 |