16-C195 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 16POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Termination Post Length | Current Rating (Amps) | Type | Type | Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Contact Finish - Mating | Termination | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Contact Material - Mating | Features | Housing Material | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 0.04 in | 1.02 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Tin | 200 µin | 5.08 µm | Brass | Gold | Wire Wrap | Through Hole | -55 C | 105 ░C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.04 in | 1.02 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Tin | 200 µin | 5.08 µm | Brass | Gold | Solder | Surface Mount | -55 C | 105 ░C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Gold | 10 Áin | 0.25 çm | Brass | Gold | Solder | Through Hole | -55 C | 125 °C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.125 in | 3.18 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Tin | 200 µin | 5.08 µm | Brass | Gold | Solder | Through Hole | -55 C | 105 ░C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.04 in | 1.02 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Tin | 200 µin | 5.08 µm | Brass | Gold | Wire Wrap | Through Hole | -55 C | 105 ░C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.04 in | 1.02 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Gold | 10 Áin | 0.25 çm | Brass | Gold | Wire Wrap | Through Hole | -55 C | 125 °C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |
Aries Electronics | UL94 V-0 | 0.04 in | 1.02 mm | 3 A | 7.62 mm | 0.3 in | DIP | 0.25 µm | 10 µin | Gold | 10 Áin | 0.25 çm | Brass | Gold | Wire Wrap | Through Hole | -55 C | 125 °C | Beryllium Copper | Closed Frame | Polyamide (PA46) Nylon 4/6 Glass Filled | 2 | 16 | 8 | 0.1 " | 2.54 mm | 0.1 in | 2.54 mm |