44-6570 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Current Rating (Amps)	Termination Post Length	Termination Post Length	Material Flammability Rating	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Contact Material - Mating	Mounting Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Termination	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Mating	Pitch - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid)	Contact Material - Post	Contact Finish - Post	Housing Material
Aries Electronics 44-6570-16	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	50 µin	1.27 µm	Closed Frame	Beryllium Nickel	Through Hole	Nickel Boron	0.1 in	2.54 mm	Solder	1.27 µm	50 µin	0.1 "	2.54 mm	2 22	44	Beryllium Nickel	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-6570-11	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	10 µin	0.25 µm	Closed Frame	Beryllium Copper	Through Hole	Gold	0.1 in	2.54 mm	Solder	0.25 çm	10 Áin	0.1 "	2.54 mm	2 22	44	Beryllium Copper	Gold	Polyphenylene Sulfide (PPS) Glass Filled
Aries Electronics 44-6570-10	1 A	0.11 in	2.78 mm	UL94 V-0	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	200 µin	5.08 µm	Closed Frame	Beryllium Copper	Through Hole		0.1 in	2.54 mm	Solder	5.08 µm	200 µin	0.1 "	2.54 mm	2 22	44	Beryllium Copper	Tin	Polyphenylene Sulfide (PPS) Glass Filled