48-6572 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET ZIF 48POS GLD
| Part | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) [y] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [x] | Type | Type | Housing Material | Contact Finish - Post | Pitch - Post | Pitch - Post | Contact Material - Post | Mounting Type | Contact Material - Mating | Contact Finish - Mating | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Closed Frame | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | 2 | 48 | 24 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Beryllium Copper | Gold | Solder | 0.25 µm | 10 µin |
Aries Electronics | 0.11 in | 2.78 mm | UL94 V-0 | 1 A | Closed Frame | 0.1 " | 2.54 mm | 10 Áin | 0.25 çm | 2 | 48 | 24 | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | Polyphenylene Sulfide (PPS) Glass Filled | Gold | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Beryllium Copper | Gold | Solder | 0.25 µm | 10 µin |