18-6513 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Termination Post Length	Termination Post Length	Material Flammability Rating	Current Rating (Amps)	Contact Material - Post [custom]	Type [custom]	Type [custom]	Type	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Finish - Mating	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Pitch - Mating	Pitch - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Material - Mating	Features	Termination
Aries Electronics 18-6513-11	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Gold	18	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C	Beryllium Copper	Closed Frame	Solder
Aries Electronics 18-6513-10	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Tin	Gold	18	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C	Beryllium Copper	Closed Frame	Solder
Aries Electronics 18-6513-11H	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	15.24 mm	0.6 in	DIP	10 Áin	0.25 çm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Gold	Gold	18	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C	Beryllium Copper	Closed Frame	Solder
Aries Electronics 18-6513-10H	0.125 in	3.18 mm	UL94 V-0	3 A	Brass	15.24 mm	0.6 in	DIP	200 µin	5.08 µm	Through Hole	Polyamide (PA46) Nylon 4/6 Glass Filled	0.25 µm	10 µin	Tin	Gold	18	0.1 in	2.54 mm	0.1 "	2.54 mm	-55 C	105 ░C	Beryllium Copper	Closed Frame	Solder