48-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS GLD

Part	Material Flammability Rating	Termination Post Length	Termination Post Length	Current Rating (Amps)	Contact Material - Mating	Type	Type	Features	Mounting Type	Contact Finish - Mating	Pitch - Post	Pitch - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post	Contact Finish - Post	Housing Material	Number of Positions or Pins (Grid) [y]	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [x]	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 48-6574-10	UL94 V-0	0.11 in	2.78 mm	1 A	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	Through Hole	Gold	0.1 in	2.54 mm	Solder	0.1 "	2.54 mm	0.25 µm	10 µin	Beryllium Copper	Gold	Polyphenylene Sulfide (PPS) Glass Filled	2	48	24	10 Áin	0.25 çm
Aries Electronics 48-6574-18	UL94 V-0	0.11 in	2.78 mm	1 A	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	Through Hole	Gold	0.1 in	2.54 mm	Solder	0.1 "	2.54 mm	0.25 µm	10 µin	Beryllium Copper	Gold	Polyphenylene Sulfide (PPS) Glass Filled	2	48	24	10 Áin	0.25 çm
Aries Electronics 48-6574-11	UL94 V-0	0.11 in	2.78 mm	1 A	Beryllium Copper	DIP ZIF (ZIP)	0.6 " (15.24mm) Row Spacing	Closed Frame	Through Hole	Gold	0.1 in	2.54 mm	Solder	0.1 "	2.54 mm	0.25 µm	10 µin	Beryllium Copper	Gold	Polyphenylene Sulfide (PPS) Glass Filled	2	48	24	10 Áin	0.25 çm