36-6552 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 36POS
| Part | Current Rating (Amps) | Material Flammability Rating | Termination Post Length | Termination Post Length | Termination | Contact Finish - Mating | Contact Finish - Post | Contact Material - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Pitch - Mating | Pitch - Mating | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Material - Post | Housing Material | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Solder | Nickel Boron | Nickel Boron | Beryllium Copper | Closed Frame | 50 µin | 1.27 µm | 0.1 " | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 1.27 µm | 50 µin | 36 | 0.1 in | 2.54 mm | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | ||
Aries Electronics | 1 A | UL94 V-0 | 0.11 in | 2.78 mm | Solder | Nickel Boron | Nickel Boron | Beryllium Nickel | Closed Frame | 50 µin | 1.27 µm | 0.1 " | 2.54 mm | DIP ZIF (ZIP) | 0.6 " (15.24mm) Row Spacing | 1.27 µm | 50 µin | 36 | 0.1 in | 2.54 mm | Beryllium Nickel | Polyetheretherketone (PEEK) Glass Filled | Through Hole | -55 C | 250 °C |